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2026-09-19 · Source:TechRadar

Samsung is moving additional DDR5 and SSD production to third parties, keeping internal capacity for HBM, advanced packaging and higher-value memory products.
Samsung is shifting additional DDR5 DRAM and SSD production to third-party manufacturers, reserving its internal capacity for HBM, advanced packaging, and other higher-value memory products. The move amounts to a deliberate reallocation of the company's in-house output toward the memory segments commanding the strongest returns, with commodity-class DDR5 modules and SSDs increasingly handled by outside partners.
The report positions Samsung as potentially following a path already charted by Micron, which has turned to third parties for DDR5 and SSD production in order to concentrate its own capacity on HBM and enterprise products regarded as more lucrative. Samsung now appears to be making a comparable calculation, reserving internal lines for the memory types that deliver the greatest value per unit of capacity.
Strategically, the reallocation underlines how thoroughly high-value memory has reshaped vendor priorities. Advanced packaging and HBM production are capacity-intensive, and every wafer committed to commodity DDR5 or SSD output is a wafer unavailable for the products now generating the strongest returns. For buyers, the practical effect is that mainstream DDR5 and SSD supply will lean more heavily on third-party manufacturing, while Samsung's own facilities concentrate on the higher-value memory tiers.
The report closes by asking whether SanDisk could follow suit, raising the possibility that outsourcing commodity production in favor of an HBM and enterprise focus could extend to other memory vendors as well. That question remains open for now. What is established is that Samsung is extending its reliance on external partners for DDR5 and SSD output, with in-house capacity reserved for HBM, advanced packaging, and higher-value memory products.
Mots-clés: Samsung · Micron · SanDisk · HBM · DDR5 · SSD
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